About the bonding interface of Cu wire bonding
We introduce the features of Cu wire bonding and the selection of cross-section preparation methods!
This document explains the bonding interface of Cu wire bonding in semiconductor packages. It details the purpose and wire bonding, the characteristics of Cu wire bonding, the Cu-Al compounds at the bonding center, micro voids, and the growth (diffusion) of Cu-Al compounds, accompanied by diagrams and photographs. [Contents (excerpt)] ■ Purpose and wire bonding ■ Samples and methods ■ Procedures and flow ■ Characteristics of Cu wire bonding ■ Selection of cross-sectional preparation methods *For more details, please refer to the PDF document or feel free to contact us.
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